Electrode-to-pack

Example

Use in Lemonergy

Make series/parallel architecture explicit.

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Cell-to-chassis

Integrating the cells into the vehicle floor itself, so the battery enclosure is the chassis and the cells help carry its loads. It saves mass and height but binds the battery to the car for life.

Cell-to-module-to-pack

The conventional three-level pack build: cells are assembled into modules with their own frames, sensing and connectors, and modules into the pack. Modules simplify handling, testing and repair — a faulty one can be swapped — but their frames and spacing take mass and volume that cell-to-pack designs reclaim.

Cell-to-pack

Building the pack directly from cells without the intermediate module, using large-format cells that bear load themselves. It raises the cell-to-pack ratio and cuts parts, at the cost of making the pack harder to service.

Cell-to-pack ratio

The share of a pack’s mass or volume that is cells rather than housing, cooling, busbars and electronics. It is typically 60–75 % by mass; raising it is the point of cell-to-pack and cell-to-chassis designs.

Pouch cell

A cell sealed in a flexible bag of aluminium laminated with plastic, holding stacked electrode sheets in larger cells or a flattened wound roll in many small ones. It is light and easy to cool, but needs outside support and can visibly swell if gas forms inside.

References & further reading

Further reading on this topic

These sources provide broader context; they are not presented as citations for every statement in this entry.

1. Extended Kalman filtering for battery management systems of LiPB-based HEV battery packs: Part 2. Modeling and identification

   Gregory L. Plett · Journal of Power Sources · 2004

   Topic background · Battery charge balance, open-circuit voltage, ohmic loss, polarization dynamics and model identification; parameters require cell-specific data.

2. Getting Started with the BQ76925

   Texas Instruments · 2019

   Topic background · A concrete BMS analog front-end example: cell voltage, current, temperature measurement and MCU integration.